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Custom Rigid-Flex PCB for Medical Devices – High Precision & Biocompatible Materials

Categories Rigid Flex PCB
Brand Name: xingqiang
Model Number: As Per Customer's Model
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
Product: Rigid Flexible Board
Min. Solder Mask Clearance: 0.1mm
Board Material: FR4
Surface Finishing: ENIG
Normal Layer: 2/4/6/8/10L
Pcba Standard: IPC-A-610E
Minimum Line Space: 3mil (0.075mm)
Material: High Tg FR-4+PI
Board Thinkness: 1.6/1.2/1.0/0.8mm or Customized
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Custom Rigid-Flex PCB for Medical Devices – High Precision & Biocompatible Materials

What are the advantages of our custom rigid-flex PCBs?

Our custom rigid-flex PCBs integrate rigid and flexible layers into a slim, space-saving solution, perfect for wearables and compact consumer devices. With ENIG plating, PI coverlay, and 4-layer construction, it supports high-density routing, 100,000+ flex cycles, and stable signal transmission. This all-in-one design eliminates bulky cables, cuts assembly time, and offers a lightweight, durable circuit for next-gen portable electronics.



Rigid-Flex vs. Traditional Solutions

Key FactorStandard PCBsCables/WiresRigid-Flex
Design Freedom2D OnlyLoose & Messy✅ 3D Capability
ReliabilityMany ConnectorsProne to Breakage✅ One-Piece Design
Space & WeightBulkyAdds Bulk✅ Ultra-Thin & Light
Assembly TimeSlowTime-Consuming✅ Fast & Easy



Custom Rigid-Flex PCB Manufacturing Process:

1.Design & Engineering
◦ Receive your Gerber files and specifications.
◦ Our engineers perform a DFM (Design for Manufacturability) check to optimize the design for production.
2. Material Preparation
◦ Select high-quality FR-4 (for rigid parts) and Polyimide (PI) (for flexible parts) materials.
◦ Cut the materials to the required panel size.
3. Circuit Layer Fabrication
◦ Rigid Layers: Process FR-4 cores with copper cladding, drilling, and plating.
◦ Flex Layers: Process PI films, apply adhesive (or use adhesive-less material), and form the circuit traces.
4. Layer Stack-up & Lamination
◦ Stack the rigid and flexible layers together with prepreg (bonding material).
◦ Use high temperature and pressure to press (laminate) them into a single, unified board.
5. Drilling & Plating
◦ Drill holes for vias (connections between layers).
◦ Perform PTH (Plated Through-Hole) process to make the holes conductive, electrically connecting all layers.
6. Outer Layer Processing
◦ Image the outer circuits and etch away excess copper.
◦ Apply solder mask (the green/blue/black coating) to protect the board.
7. Surface Finish
◦ Apply the chosen surface treatment, such as ENIG (Immersion Gold) or HASL, to ensure excellent solderability.
8. Coverlay Application (Flex Area)
◦ Apply a protective PI coverlay (instead of solder mask) on the flexible regions to allow bending.
9. Profile Routing & Depaneling
◦ Use a router or laser to cut the board to its final shape.
◦ Remove excess material and separate individual PCBs.
10. Electrical Testing & Quality Control
◦ Perform 100% E-Test to check for short circuits or open circuits.
◦ Inspect for defects (AOI - Automated Optical Inspection).
11. Packaging & Shipping
◦ Package the finished PCBs in anti-static bags.
◦ Ship them to your location.


Factory showcase


PCB Quality Testing



Certificates and Honors



Quality Custom Rigid-Flex PCB for Medical Devices – High Precision & Biocompatible Materials for sale
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