High-precision Spraying Off-line Selective Wave Soldering Machine
For Small-batch DIP Through-hole Production
Product Overview
HSTECH off-line selective wave soldering machine is engineered for mix-variety, small-batch DIP plug-in soldering. This integrated system combines flux spraying, infrared
preheating, and selective wave soldering in a single compact unit,
enabling fast production startup without custom fixtures.
Occupying only approximately 1㎡ of floor space, the equipment
conserves valuable workshop area. Compared to conventional wave
soldering systems, it significantly reduces consumption of solder
dross, flux, and electricity. The machine delivers nearly 100%
through-hole tin penetration rate with soldering yield exceeding
98%, providing a cost-effective PCBA through-hole soldering
solution for automotive electronics, industrial control, and
medical electronics industries.
Controlled by an Industrial PC, the machine supports offline visual programming. Operators can
complete programming on office computers and import files directly
to the machine for production. Real-time video monitoring and
automatic wave-crest height detection ensure visible soldering
processes and simplified commissioning. The fully-titanium solder
pot offers exceptional molten-solder corrosion resistance with a
quick-detach design for convenient maintenance.
Key Advantages
- Flexible Production, No Fixture Required: Supports quick change-over for multiple products. PCBs with safe
clearance can be soldered directly without custom tooling costs for
new product sampling.
- Ultra-low Operating Cost: 15KG solder pot capacity generates only 0.2KG solder dross per
8-hour shift. Sealed flux spraying system eliminates flux
evaporation waste. Total power consumption of 3.5KW significantly
reduces energy usage compared to traditional wave soldering.
- Superior Soldering Quality: Dual-side infrared preheating (top & bottom) with synchronized
preheating and soldering minimizes thermal shock for heat-sensitive
components. Automatic alignment and height measurement ensure
stable solder flow with 100% through-hole penetration rate and over
98% yield. N₂ protection (99.999% purity) delivers bright solder
joints with minimal oxidation.
- High-precision Spraying & Soldering System: Original Japan Lumina 0.5 mm precision flux spray nozzle.
Interchangeable soldering nozzles from φ3 mm-φ20 mm with custom
sizes available, matching dedicated nozzles for each joint to
precisely control flux dosage and soldering time.
- Intelligent Software & Visual Monitoring: Offline image-based programming allows importing PCB graphics to
draw soldering paths. Real-time video displays wave-crest
conditions and soldering performance for comprehensive process
observation.
- Compact Footprint & Easy Maintenance: Approximately 1㎡ floor area with quick-release solder pot and
centralized wiring. Liquid-gas modules are physically isolated from
electrical cabinet to enhance safety and simplify service work.
Technical Specifications
| Specification | SW-320YT | SW-450YT |
|---|
| Applicable PCB Size | 50×50 ~ 320×250 mm | 50×50 ~ 450×400 mm |
| PCB Thickness | 0.8-3 mm; Pin length <3 mm | 0.8-3 mm; Pin length <3 mm |
| Component Height | Top side <100 mm / Bottom side <50 mm | Top side <100 mm / Bottom side <50 mm |
| Max. PCB Weight (with components) | ≤5 KG | ≤5 KG |
| Solder Pot | Full titanium alloy, 15KG capacity, 1.8 KW power | Full titanium alloy, 15KG capacity, 1.8 KW power |
| Preheating Power | Infrared 1 KW | Infrared 1 KW |
| Total Power | AC 220V, 3.5 KW | AC 220V, 3.5 KW |
| Nitrogen Requirement | Purity 99.999%; Pressure 0.5 MPa; Consumption 20-30 L/min | Purity 99.999%; Pressure 0.5 MPa; Consumption 20-30 L/min |
| Flux Tank Capacity | 2 L | 2 L |
| Air Supply Pressure | 0.5-0.7 MPa | 0.5-0.7 MPa |
| Soldering Nozzle Inner Dia. | φ3-φ20 mm, custom-supported | φ3-φ20 mm, custom-supported |
| Control System | Industrial PC + (Windows OS) | Industrial PC + (Windows OS) |
| Programming Mode | Online / Off-line image visual programming | Online / Off-line image visual programming |
| Machine Weight | 120 KG (including 15KG solder) | 150 KG (including 15KG solder) |
| External Dimension (with monitor) | 750 × 950 × 1350 mm | 880 × 1280 × 1350 mm |
Application Industries
Industrial control PCBA, automotive electronics, security
equipment, medical electronics, power supply modules, communication
modules, small-batch DIP through-hole assembly and new product
sampling.
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