UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45 Shore00 With Grey Colour For RDRAM Memory Modules

5W / MK,UL recognized thermal conductive gap filler 45 shore00 with grey colour For RDRAM memory modules

The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal conductivity of 5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The TIF5180-50-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

TIF500-50-11S Datasheet-REV02.pdf

Features:
> Good thermal conductive: 5.0W/mK
>Thickness:4.5mmT

>Soft and compressible for low stress applications

>Outstanding thermal performance

>Fiberglass reinforced for puncture, shear and tear resistance

>Electrically isolating

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Semiconductor automated test equipment (ATE)

>CPU

>Memory Modules

>Mass storage devices

>Automotive electronics

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068