Through Hole 0.12mm PCB SMT Stencil Electro Polishing of rfpcb-board-com

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Through Hole 0.12mm PCB SMT Stencil Electro Polishing

Categories	PCB Blog
Brand Name:	Bicheng
Model Number:	BIC-951.V1.0
Certification:	UL, ISO9001, IATF16949
Place of Origin:	CHINA
MOQ:	1PCS
Price:	USD9.99-99.99
Payment Terms:	T/T
Supply Ability:	5000PCS per month
Delivery Time:	8-9 working days
Packaging Details:	Vacuum bags+Cartons
Base material:	Stainless steel shim
Stencil size:	520 x 420 mm =1 PCS
Stencil thickness:	0.12mm
Structure:	Stencil foils with aluminum frame
Aperture:	Laser cut
Appearance:	Engraving and electro polishing
Fiducial mark:	Through hole
Quantity of open pads:	1254

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Bicheng Electronics Technology Co., Ltd

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Through Hole 0.12mm PCB SMT Stencil Electro Polishing

Laser SMT Stencil Made of 0.12mm Stainless Steel Foil With 520 X 420mm Aluminum Frame

1.1 General description

This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center.Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits

The data file is used directly to produce and reduce the error rate;

The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;

The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;

Quick and on-time delivery;

Great customer service;

Diversified shipping method;

No MOQ, low cost for prototypes and small runs quantity;

1.3 Applications

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	520 x 420 mm =1 PCS
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.12mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1254
Advantages:	a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Holes Design for SMT Stencil

Component Type	Pitch	Soldering Width	Soldering Length	Opening Width	Opening Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm

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